Benchtop solder paste thickness inspection BT-460
Benchtop solder paste thickness inspection BT-460

Benchtop solder paste thickness inspection BT-460

Solder paste thickness inspection BT-460 is mainly used to measure the thickness of solder layer on PCB. Its principle is that a very thin laser beam is emitted by the laser to illuminate the PCB at a certain Angle, and then the camera is used to observe the laser beam forming a thin line on PCB.Solder paste height and its bottom (PCB) will form a certain height difference, so that the laser line formed a certain break.The software calculates the height difference between the solder paste and the circuit board based on the laser break.

The software interface is simple and easy to operate.

The software interface is simple and easy to operate.

The software can calculate the CPK value through the measured value

The software can calculate the CPK value through the measured value

Option:Y axis auto move to obtain the real solder paste thickness(the camre is 3million pixels) ,the 3D data model restructuring is more convenient to analysis.

Option:Y axis auto move to obtain the real solder paste thickness(the camre is 3million pixels) ,the 3D data model restructuring is more convenient to analysis.

Benchtop solder paste thickness inspection BT-460 Specification

Model

BT-460

Tiptop measure precision

0.001mm

Repetive accuracy

±0.003mm

Lens magnification

4X

Optics inspection system

1.3 million pixels

Platform system

manual(option:Y axis auto)

Measuring principle

No-touch laser bean

Max meansure height

1mm

SPC software

Cpk,Cp,Xbar,R&S

Computer system

Windows7

Power source

1Ph,AC220V,50/60HZ

Size

460*500*350mm

Weight

25kg

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