BGA Rework Station PRO-660
BGA Rework Station PRO-660

BGA Rework Station PRO-660

PRO-660 is the strengthen version of Pro-650. With all the function 650 have, it can handle bigger PCB.

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Easily-adjusted PCB positioning bracket

PCB positioning is realized by V-shaped slots. Flexible, simple and portable universal fixture can protect PCBs, prevent components along PCB edges from damage and PCBs from deformation, and can adapt to the rework of encapsulated BGAs with various sizes. Maximum PCB size to be held is 450mm x 450 mm and the minimum PCB size is 8mm x 8mm.

Independent three-zone temperature control system.JPG

Independent three-zone temperature control system

Pro-660’s three temperature zone are heated independently, where both upper and lower temperature zones are heated by hot air and the bottom zone is heated by infrared heater with a temperature accuracy of ±3℃. Both upper and lower heaters can control different zones’ temperatures simultaneously; the IR pre-heater at the bottom zone can heat PCBs evenly. Meanwhile, IR preheating zone’s power output can be adjusted according to actual requirements so that temperatures can be set reasonably for more safe and reliable rework.

Integrated design for upper temperature zone.JPG

Integrated design for upper temperature zone

Upper heating head and mounting head are designed in an integrated way with the functions of automatic soldering and automatic mounting. Unique hot-air nozzle and mounting head’s dual-pressure sensor protection ensure that the BGA chips are not damaged by pressing. At the same time, it is equipped with various BGA hot-air nozzles which can be rotated by 360° arbitrarily, installed and replaced easily, and customized according to customer requirements. The enclosed laser alignment device can help realize fast alignment.

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Micrometer is used to realize accurate X/Y-axis and R-angle alignment

Micrometer is used to realize accurate X/Y-axis and R-angle alignment with a precision of ±0.02mm.

Accurate optical-alignment system.JPG

Accurate optical-alignment system

High-resolution CCD optical visual alignment system is used with spectral, amplification, fine-tuning, and auto-focus functions and also equipped with automatic chromatism discrimination and brightness adjuster. Imaging resolution can be adjusted manually and displayed by 15” high-definition LCD, thus ensuring a simple, fast and accurate alignment between BGA chips and PCB pads with an alignment accuracy within 0.01-0.02 mm.

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K-type closed-loop thermo-couple controller

High-precision K-type thermocouple is used as closed-loop controller with three external temperature interfaces to realize precise temperature measurement.

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Cooling and exhausting systems

High-power cross-current fan can cool PCBs rapidly, thus preventing PCBs from deformation and ensuring higher soldering quality. Dual-channel exhausting system is included to prevent harmful gas from diffusion.

Upper temperature zones’ air flow adjuster can control flow accurately.JPG

Upper temperature zones’ air flow adjuster can control flow accurately.

Upper temperature zones’ air adjuster can control air flow accurately, thus preventing small BGAs or surrounding components from being blown away by too high flow.

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Multi-function humanized operating system

HD touch-screen man-machine interface and PLC controller are used. Three temperature curves can be shown simultaneously. The default temperature curves can be selected randomly or this interface may be used to modify and create the temperature curves. Temperatures can be precisely controlled within ±1 degree. De-soldering, mounting, or soldering mode can be selected and intelligent automation is also possible.

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Self-defined temperature curve unit

6 zones’ temperatures are controlled independently which include preheating, heat preservation, heating, soldering and cooling respectively. Excellent temperature controlling system can guarantee better soldering effect. It can store 1-100 groups of temperature curves. You may perform curve analysis or change the settings simultaneously on touch screen.

PRO-660 Specification

PCB Specification

PCB Size (Minimum)

8*8mm

PCB Size (Maximum Allowable)

450*450mm

PCB Size (Recommended Max.)

450*350mm

PCB Thickness

0.5mm-6mm

Component Specification

Component Size

MAX 60*60mm MIN 2*2mm

Minimum BGA Ball pitch

0.3mm

Placement Precision

±0.02mm

Heating System

IR Bottom-heater

400*350mm(4200W)

Component heater (Top)

Hot Air 800W

Component heater (Bottom)

Hot Air 1200W

Temperature Control

K-Type Thermocouple; Closed Loop PID

Machine Specification

Main Power Source

Single phase AC 220V 50/60Hz

Total Power Consumption

6400W

Machine Dimensions

L1000*W880*H990mm

Net Weight

105KG

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