BGA Rework Station PRO-880+
BGA Rework Station PRO-880+

BGA Rework Station PRO-880+

PRO-880+ is equipped with 100x camera, 4 thermocouple for real time profiling, 12 bottom heater and Panasonic servo moving system, can positioning, dismantle, pick&place, soldering automaticlly. Patently designed with movable upper/bottom heater, can rework many BGA with one time positioning.

Independent three-zone temperature control system.JPG

Independent three-zone temperature control system

Both upper and lower temperature zones are heated by hot air and the bottom zone is heated by infrared heater with a temperature accuracy of ±2℃. Both upper and lower heaters can heat components’ top sides and PCBs’ bottom sides simultaneously; bottom pre-heater can move along X and Y axis freely. Both upper and lower heaters can control 8 zones’ temperatures simultaneously. IR pre-heating zones’ heating area can be adjusted according to actual requirement so that PCBs are heated evenly.

Large-area(12-Zone) Bottom IR heater.JPG

Large-area(12-Zone) Bottom IR heater

Both BGA chip and PCBs can be heated in a localized way simultaneously, at the same time, PCBs’ bottom sides can be preheated by infrared heater in a large-area way complementarily, so PCB deformation during rework can be avoided completely.

Real-Time Data Recording and Profile Analysis.JPG

Real-Time Data Recording and Profile Analysis

High-precision K-type closed-loop thermocouple controllers and PID-parameter self-defining system are used. It can display seven temperature curves simultaneously and store numerous sets of user data. USB can be used to copy such data and real-time curve analysis is possible. The external temperature measuring interface enables precise temperature detection which can analyze and correct at any time the actually collected temperature data.

Accurate optical-alignment system.JPG

Accurate optical-alignment system

High-resolution adjustable color CCD optical visual alignment system is used for accurate optical alignment with spectral, amplification, de-amplification and fine-tuning functions and also equipped with automatic chromatism discrimination and brightness adjuster. Imaging resolution can be adjusted and displayed by 15” high-definition LCD to bring us a higher automation, thus avoiding human operating error completely, achieving the best rework for lead-free Socket775 and double-layer BGAs and other device.s So, it can adapt to lead-free rework totally.

Powerful locomotor system.JPG

Powerful locomotor system and Accurate Positioning device

The alignment system uses a joystick as controller which can control manually the movement of the optical system forwards, backwards, leftwards, and rightwards so that you can observe BGA chips’ four corners and center how the alignment status is, thus putting an end to “Observation blind-angle”. X axis, Y axis and R angle are fine-tuned by micrometer to bring us an accurate alignment with a precision of ±0.01mm. It is equipped with an infrared laser-positioning device so that locking is realized automatically after positioning is finished.

Easy Adjust PCB Clamping System.JPG

Easy Adjust PCB Clamping System

PCB positioning is realized by means of V slots for quick, easy and accurate positioning to lay out different PCBs and position PCBs with different sizes. Flexible, portable and movable universal fixture can protect PCBs and prevent PCB deformation and damage to components along PCB edges, thus ensuring the success rate of your reworks and adapting to the reworks of BGAs with various encapsulation sizes.

Operating system.JPG

Multi-function humanized operating system

HD touch-screen man-machine interface is used where you can select “Debug interface” or Operating interface” to prevent any wrong setting. Upper heating device and mounting head are made in an integrated way. Screw transmission system is available. Z-axis movement is controlled by Panasonic servo control system which can control both positioning and heating points accurately and identify sucking and mounting heights automatically, thus bringing us the functions of automatic soldering and de-soldering. Temperature, time, slope, cooling status and alarm all are displayed on touch screen. It is also equipped with various titanium-alloy BGA hot-air nozzles which can rotate by 360°and are easy to install and replace.

Self-defined temperature curve unit.jpg

Self-defined temperature curve unit

It can store groups of temperature settings and remember groups of various BGA chips’ heating points. You can analyze, set and correct temperature parameters with curves on touch screen at any time. Meanwhile, the machine does not need any external device (such as personal computer), but can download, print and save curve data by means of the built-in USB port.

PRO-880+ Specification

PCB Specification

PCB Size (Minimum)

8*8mm

PCB Size (Maximum Allowable)

615*480mm

PCB Size (Recommended Max.)

550*380mm

PCB Thickness

0.5mm-6mm

Component Specification

Component Size

MAX 60*60mm MIN2*2mm

Minimum BGA Ball pitch

0.3mm

Placement Precision

±0.01mm

Heating System

IR Bottom-heater

540*420mm(7200W)

Component heater (Top)

Hot Air 1200W

Component heater (Bottom)

Hot Air 1200W

Temperature Control

K-Type Thermocouple; Closed Loop PID

Machine Specification

Main Power Source

Single phase AC 380V 50/60Hz

Total Power Consumption

9700W

Machine Dimensions

L890*W940*H1000mm

Net Weight

140KG

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