Inline SPI Machine S-250I/S500I
Inline SPI Machine S-250I/S500I

Inline SPI Machine S-250I/S500I

Inline SPI Machine S-250I/S500I were designed to make in-house Inline SPI , This series SPI apply to small and normal size PCB , and satisfy customers with small investment to inspect printing quality, moving convenience, simple operation and high accuracy,  the highest cost performance options for customers. and acceptable by CE certification.

Programmable spatial light modulation(PSLM)

Programmable spatial light modulation(PSLM).
Original structure of programmable grating can be using the software of raster cycle carefully. Cancelled the driver stage mechanical transmission parts, improve the accuracy of the equipment and the applicable scope (detection height up to + / - 1200um), avoiding the mechanical wear and maintenance cost.

Phase modulation profiler metry

Phase modulation profiler metry
Through the phase modulation of full light spectrum, provide a height resolution down to (0.37um), the number of 4-8 times sampling ensure high repeatability . Use high-precision ball screw and linear guide rail to realize perfect detection result.

3D Diffuse lighting

3D Diffuse lighting & active RGB 2D light source
The use of synchronous structure light perfect solve the influence of the shaded part in solder paste inspection. Based on RGB two-dimensional light source, perfect the base board of high contrast. Like black solder mask and ceramic PCB, etc. Meanwhile, we can provide 2D/3D solder paste color images.

High resolution image processing system

High resolution image processing system

Ultra-high frames of 400/800/1200 pixel industrial CCD to ensure that the extremely small components and high precision SMT (01005) were stable and rapid detection. Provide 8um,10um, 12um, 15um,18um, 20um, such as a variety of precision. Cooperate with the customer's product diversity and detection speed requirements.GPU hardware plus optimized 2D/3D parallel algorism realize high speed inspection on high density PCB (>100K Pads/ PCB).

Z axis real time and static vision compensation capability

Z axis real time and static vision compensation capability

The Characteristics of PSLM provide the real-time dynamic tracking on the rigid PCB, for flexible PCB, use static vision compensation to perfectly solve the warpage problems of flexible PCB.

Coaxial lighting mark camera unit (option)

Coaxial lighting mark camera unit (option)

Optional coaxial lighting mark camera unit can reliable and precise detect fiducial mark on HASL, immersion gold and flexible PCB.

Glue Inspection

Glue Inspection

PLSM 3D measurement can reach +/-1200um with RGB Tune function is capable of high accurate measuring of none transparent glue process. Including missing, overflow, excess, shape and combination view of 2D/3D images.

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Multi Array Mark Detection

For multi-array PCB mark, use dynamic capture function, there is no need to capture image one by one and reduce detect time dramatically.

Bad mark on the fly detection function.jpg

Bad mark on the fly detection function.

Automatically on the fly detect PCB bad mark, feed the info into pick and place machine in real time control loop.

Three stage mapping traceability.jpg

Three stage mapping traceability.

Collaborate with pre and post AOI in SMT line, forms close loop process and quality control system, and capable to integrate and synchronize the data to customer ERP quality module.

Inline SPI Machine S-250I/S500I - Specifications

Model

S-250I

S-500I

Maximum PCB Size (X x Y)

350mm x 250mm

510mmX505mm

Minimum Inspection Size

Square: 150um/Round: 200um

PCB Weight

0-3Kg

PCB Warpage

+/-3.5um

Minimum Pad Spacing

100um

Inspection Principle

3D white color PLSM PMP

Camera

4M pixels industrial camera

Inspection Accuracy

X/Y direction 10um, Z direction below 0.37um

Repeat Position Accuracy

Z direction:<1um/ Volume: <1%

FOV

48mm x 34mm

Positioning Time

0.5 second/pcs

Maximum Measuring Height

+/-350um (Standard), +/-1200um (option)

Inspection categories

Volume/Area/Height/Offset/Sharp

Inspection Capability

Missing solder/Solder bridge/Offset/Tombstoning/More or Lack solder paste/ etc

Inspection speed

3750mm2/s

Operation System

WINDOWS 7

Optional

1D/2D Barcode , UPS

Weight

865Kgs

Dimensions

1000X1000X1350mm

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