X-Ray use to examine internal solder joints, BGA, IC and other complex components.It adopts the structure of high resolution enhanced screen and sealed microcoking X ray tube combination, through X-ray non-destructive fluoroscopy, real-time observation of clear pictures
Model NO.: X-Chip-A350
Model NO.: CCM-470
Model NO.: CX-3500
Model NO.: CX-3000A
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