X-Ray use to examine internal solder joints, BGA, IC and other complex components.It adopts the structure of high resolution enhanced screen and sealed microcoking X ray tube combination, through X-ray non-destructive fluoroscopy, real-time observation of clear pictures
Model NO. X-Chip-A350
Model NO. CCM-470
Model NO. CX-3500
Model NO. CX-3000A
End of content
No more pages to load
