Vapor Phase Reflow Oven VS-500-IV
Vapor Phase Reflow Oven VS-500-IV

Vapor Phase Reflow Oven VS-500-IV

The main model of the CIF by Exmore range is the vapor phase VS-500.IV.

The concept of the machine allows to solder even the most complex cards of a format of 500 x 500 x 60 mm while ensuring optimal quality thanks to,

• The inert atmosphere resulting from the fluid (medium) used

• An incomparable temperature delta across the entire component

• No possible handling error during the cycle

The main model of the CIF by Exmore range is the vapor phase VS-500.IV. 

The concept of the machine allows to solder even the most complex cards of a format of 500 x 500 x 60 mm while 

ensuring optimal quality thanks to, 

• The inert atmosphere resulting from the fluid (medium) used 

• An incomparable temperature delta across the entire component 

• No possible handling error during the cycle 

The main applications relate to lead and lead-free soldering, conductive adhesives and repair. 

The concept of the vapor phase CIF by Exmore allows today, 

• Reducing fluid consumption (medium) using a unique vapor recovery system; this greatly reduces production costs 

• Quick return on investment and high capacity for mixed productions 

• Inert atmosphere without the use of nitrogen gas 

• Compensation for pressure fluctuations in the tank 

• Temperature delta incomparable to other technologies throughout the working area 

• Reduced energy consumption 

• Possibility of soldering large format 500 x 500 x 60 mm cards in a small footprint 

• Compatible for repair

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