SMT Process Carriers With ROSH Feature
| ● Protect the SMT components in the back of the PCB board during the wave soldering process. |
| ● Carry an irregular shape baseboard. |
| ● Use multi-pak panel design to improve production efficiency. |
| ● Prevent the deformation of the baseboard during high temperature reflow process. |
| ● Smooth surface, patience high, can be applied to spray Teflon (Teflon) process. |
| ● Avoid gold finger contamination by human contact. |
| ● Protect the SMT components in the back of the PCB board during the wave soldering process. |
| ● Prevent the deformation of the baseboard during the wave soldering process. |
| ● Standardized the width of the production lines, eliminate the width adjustment of the production line. |
| ● Use multi-park panel design to improve production efficiency. |
| ● Prevent the surface of the baseboard from overflow tin contamination. |
