Wave solder pallet with ROSH

The pallets only expose areas of the assembly that require soldering.All other areas are protected,eliminating component damage and expensive ,low quality process steps.Made of ESD-safe composite materials,these pallets are designed and manufactured to optimize both the solderability of your circuit boards and your entire process flow.

Descriptio...
Feature

● Designed by engineers with extensive wave solder experience,our pallets enable customers to automate the soldering of through-hole components on complex eletronic assemblies.
● The pallets only expose areas of the assembly that require soldering.All other areas are protected,eliminating component damage and expensive ,low quality process steps.Made of ESD-safe composite materials,these pallets are designed and manufactured to optimize both the solderability of your circuit boards and your entire process flow.

Wave solder pallet with ROSH Feature

● Eliminate hand soldering processes.

● Eliminate high-defect,surface mount glue operations.

● Eliminate temporary solder masking operations

● Reduce assembly cycle time,improves quality,impove component alignment and soldering

● Improved solder fill and quality

● Eliminates flooding problems,increases your flexibility

● Eliminates board size/panelizationn issues

● Standardize on conveyor width

● Effectively process complex,double-sided surface mount assemblies,easy to use

● Designed by engineers with extensive wave solder experience

● Optimized for easy profiling

● Supports rapid set-up using our ergonomically designed fasteners

● Optimized for best soldering

● Wave solder automation to solder through-hole components on complex electronic assemblies.

● Optiomize the use of your wave solder equipment,eliminate unreliable surface mount gluing operations,and wave solder pallets protect backside areas of your circuit board assembly while directing solder to components that you want wave soldered.made of ESD-safe composite materials,these pallets are designed and manufactured to optimize both the solderability of your circuit boards and your entire process flow.