THT Solder Joint Automated Inspection System BA-400/BA-550
THT Solder Joint Automated Inspection System BA-400/BA-550

THT Solder Joint Automated Inspection System BA-400/BA-550

BA-400/BA-550 is a bottom type AOI equipment for throughhole solder joint inspection and chip component inspection  . BA-400/BA-550 uses intelligent algorithm which can just click one button for programming , it greatly reduce the programming and debugging work , AI deep learning and self-training function can extend detectable defect types to reduce the misjudgement rate.

THT Solder Joint Automated Inspection System Dimension :

Dimension of the machine :

Dimension of the machine

THT Solder Joint Automated Inspection System Hardware:

High stability granite platform ensure machine running fast and stably.

High stability granite platform ensure machine running fast and stably.

X/Y servo motor with high precision ball screw driving system ensures running accuracy.

X/Y servo motor with high precision ball screw driving system ensures running accuracy.

Equipped with  5M pixels CCD with RGB 3 color light source to ensure inspection accuracy.

Equipped with 5M pixels CCD with RGB 3 color light source to ensure inspection accuracy.

Heavy roller chain conveying system which can bear the weight of fixture.

Heavy roller chain conveying system which can bear the weight of fixture.

The top of the RGB 3 color light source  is equipped with a air blow-type cleaning device, which can effectively clean the foreign matter such as tin dross on the top of the RGB 3 color light source.  Keep the CCD and RGB 3 color light source clean.

The top of the RGB 3 color light source is equipped with a air blow-type cleaning device, which can effectively clean the foreign matter such as tin dross on the top of the RGB 3 color light source. Keep the CCD and RGB 3 color light source clean.

THT Solder Joint Automated Inspection System Algorithm:

Intelligent neural network algorithm:

The traditional algorithm is mainly to compare the color of the reflected light of the soldering joint, and then to judge whether it has bad quality. In this case, the programmer is required to be experienced and familiar with the various forms of bad products. Neural network algorithm through the analysis of big data processing, can know the various forms of solder joints,and low requirements for the operator.

THT Solder Joint Automated Inspection System Algorithm

THT Solder Joint Automated Inspection System Algorithm:

Intelligent algorithm also can train the components with large sample images to comprehensively recognize the features of the components to improve the misjudge problems.

Priciple comparision with raditional algorithm

Priciple comparision with raditional algorithm

THT Solder Joint Automated Inspection System Programming:

Easy programming: Use Intelligent algorithm which can automatically search chip components and solder joint on the PCB image without CAD files, and give the parameters, operator only need to fine-tune the program, it makes programming very easy.

THT Solder Joint Automated Inspection System Programming

THT Solder Joint Automated Inspection System Software function:

Path optimization:

Fewer FOVs : Do not photograph on where there is no solder joints to reduce FOVs and make inspection more efficient. Shorter photographing paths to save time

More suitable imaging position : avoid solder joint at FOV junction to ensure test effect.

THT Solder Joint Automated Inspection System Software function

THT Solder Joint Automated Inspection System Software function:

Multiple detection and debugging modes:

◆ Support panel board detection.

◆ Support mixed board detection, suitable for small-batch multi-PCB detection.

◆ Badmark skip mode.

◆ Online programming and debugging without stopping the production line.

◆ Offline programming (optional ).

THT Solder Joint Automated Inspection System Data statistic:

Powerful data statistic software, easy to search and to be exported as a Exel file.

THT Solder Joint Automated Inspection System Data statistic

THT Solder Joint Automated Inspection System Specifications

Model BA-400 BA-550
Image System Camera 5Mpixels CMOS Camera 5Mpixels CMOS Camera
Resolution 15µm 15µm
FOV size 36*30mm 36*30mm
Lighting 3 color ring shape LED(RGB) 3 color ring shape LED(RGB)
Motion System X/Y Movement AC Servo motor AC Servo motor
Platform Granite, ball screw and linear rail. Granite, ball screw and linear rail.
With adjustment Auto/Manual Auto/Manual
Flow Direction L→R L→R
Hardware PC configuration Intel I5 CPU, 32G DDR , 256G SSD +2T hard disk Intel I5 CPU, 32G DDR , 256G SSD +2T hard disk
Communication SMEMA SMEMA
Power Supply 1ph 220V,50/60Hz , 1KW 1ph 220V,50/60Hz , 1KW
Air Supply 0.4-0.6Mpa 0.4-0.6Mpa
Machine Size L1100*D1220*H1350mm(not including display and light tower) L1100*D1420*H1350mm(not including display and light tower)
Weight 800kg 890kg
Software Operation System Ubuntu 14.04 LTD 64bit Ubuntu 14.04 LTD 64bit
Programming Online programming, offline programming, Gerber file loading, one-key programming with image Online programming, offline programming, Gerber file loading, one-key programming with image
Statistic data function SPC software SPC software
PCB Size Size 3 section rail : 50*50-350*400mm
1 section rail : 50*50-450*400mm
Single-section rail : 50*50-550*550mm, can detect max 710*550 board with 2 section inspection
Thickness 0.5-6.0mm 0.5-6.0mm
PCB Weight 3kg 3kg
Clearance Top/Bottom:110/25mm Top/Bottom:110/25mm
Clamping Edge 5.0mm 5.0mm
Inspection Catagories Component Missing, Reversed, Shift, Damaged, Skew, Redundant, Foreign material Missing, Reversed, Shift, Damaged, Skew, Redundant, Foreign material
Solderjoint No solder, Insufficient/Extra solder, Bridge, not welding, no foot, Hole No solder, Insufficient/Extra solder, Bridge, not welding, no foot, Hole
Inspection Component Chip:03015 and above LSI:0.3mm pitch and above Chip:03015 and above LSI:0.3mm pitch and above
Inspection Speed 230-250ms/FOV 230-250ms/FOV
Barcode reader 1D or 2D barcode reading by camera 1D or 2D barcode reading by camera
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