Desktop SPI Machine S-350/600
Desktop SPI Machine S-350/600

Desktop SPI Machine S-350/600

S-350/S-600 series offline SPI were designed to make in-house offline SPI , This series SPI apply to small and normal size PCB , and satisfy customers with small investment to inspect printing quality, moving convenience, simple operation and high accuracy, the highest cost performance options for customers. and acceptable by CE certification.

Programmable spatial light modulation(PSLM)

Programmable spatial light modulation(PSLM).

● Original structure of programmable grating can be using the software of raster cycle carefully. Cancelled the driver stage mechanical transmission parts, improve the accuracy of the equipment and the applicable scope (detection height up to + / - 1200um), avoiding the mechanical wear and maintenance cost.

Phase modulation profiler metry

Phase modulation profiler metry

● Through the phase modulation of full light spectrum, provide a height resolution down to (0.37um), the number of 4-8 times sampling ensure high repeatability . Use high-precision ball screw and linear guide rail to realize perfect detection result.

3D Diffuse lighting

3D Diffuse lighting

● Using the synchronization structure of light perfectly solve the shadow effect in the solder paste inspection. Such as the black substrate ceramic substrate.

High resolution image processing system

High resolution image processing system

● Ultra-high frames of 400/800/1200 pixel industrial CCD to ensure that the extremely small components and high precision SMT (01005) were stable and rapid detection. Provide 8um,10um, 12um, 15um,18um, 20um, such as a variety of precision. Cooperate with the customer's product diversity and detection speed requirements.GPU hardware plus optimized 2D/3D parallel algorism realize high speed inspection on high density PCB (>100K Pads/ PCB).

Glue Inspection

Glue Inspection

● PLSM 3D measurement can reach +/-1200um with RGB Tune function is capable of high accurate measuring of none transparent glue process. Including missing, overflow, excess, shape and combination view of 2D/3D images.

Multi Array Mark Detection

Multi Array Mark Detection

● For multi-array PCB mark, use dynamic capture function, there is no need to capture image one by one and reduce detect time dramatically.

S-350 series offline SPI - Specifications

Model

S-350

S-600

Maximum PCB Size (X x Y)

460mmX350mm

700mmX600mm

Minimum Inspection Size

Square: 150um/Round: 200um

PCB Weight

0-3Kg

PCB Warpage

+/-3mm

Minimum Pad Spacing

100um

Inspection Principle

3D white color PLSM PMP

Camera

2M pixels industrial camera (4M pixels option)

Inspection Accuracy

X/Y direction 10um, Z direction below 0.37um

Repeat Position Accuracy

Z direction:<1um/ Volume: <1%

FOV

25mm x 20mm

Positioning Time

0.3 second/pcs

Maximum Measuring Height

+/-350um (Standard), +/-1200um (option)

Inspection categories

Volume/Area/Height/Offset/Sharp

Inspection Capability

Missing solder/Solder bridge/Offset/Tombstoning/More or Lack solder paste/ etc

Inspection speed

1.5s/FOV

Operation System

WINDOWS 7

Optional

1D/2D Barcode , UPS

Weight

S-350/95Kgs

S-600/145Kgs

Dimensions

810X930X530m

1500X1100X600mm

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